Abstract: Stacking technology, such as direct bonding is a way forward for high speed photonic devices. In this work, we present silicon direct detection subassembly realized by direct aluminum – ...
Abstract: This article presents a power- and area-efficient multistandard serial link transceiver designed for application rates of up to 112 Gb/s, such as OIF CEI-112G and IEEE 802.3ck 400GBASE. The ...
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