The first article in this series titled “The common silicon issues in analog IP integration” focused on system-on-chip (SoC) design issues related to incorporating analog IP. Here we begin expanding ...
The previous articles in this series showed how the successful integration of IP—especially analog/RF, but digital as well—is essentially pre-determined by the practices of the chip development team ...
Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in 2027. This approach ...
Advanced packaging techniques are viewed as either a replacement for Moore’s Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can ...
Today’s electronic devices market demands miniaturized printed circuit boards (PCBs) with a multitude of high-speed functions integrated on a single board. This causes the designers to have traces ...
This file type includes high resolution graphics and schematics when applicable. In the development of SoC-based (system-on-chip) circuit boards, the SoC’s additional capabilities will provide ...
A significant divergence emerged as Taiwan and China concluded their major PCB industry exhibitions in late October 2025. While Taiwanese manufacturers focused on supply bottlenecks for copper-clad ...
SAN JOSE, Calif., 02 Jul 2012-- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced it has acquired Sigrity, Inc., a leading signal and power ...
The printed circuit board (PCB) industry, like almost all in the technology sector, has experienced extraordinary growth and change since its inception in the early 20th century. Changes in component ...
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