The first article in this series titled “The common silicon issues in analog IP integration” focused on system-on-chip (SoC) design issues related to incorporating analog IP. Here we begin expanding ...

The previous articles in this series showed how the successful integration of IP—especially analog/RF, but digital as well—is essentially pre-determined by the practices of the chip development team ...

Advanced packaging techniques are viewed as either a replacement for Moore’s Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can ...

Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification. Key ...

Today’s electronic devices market demands miniaturized printed circuit boards (PCBs) with a multitude of high-speed functions integrated on a single board. This causes the designers to have traces ...

This file type includes high resolution graphics and schematics when applicable. In the development of SoC-based (system-on-chip) circuit boards, the SoC’s additional capabilities will provide ...

Cadence Design Systems has started bringing artificial intelligence (AI) into the fold on its flagship chip design suite to help designers build smaller, faster processors that consume less power and ...

Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at ...