The complete wafer saw solution includes: DISCO’s fully automatic dicing saw for high-throughput, dual-cut processing, DISCO’s ablation laser saw and stealth dicing saw, Rudolph’s NSX ® inspection ...

The German tooling firm announces the development of a new texturing process for multicrystalline wafers using diamond wire sawing on its LINEX inline system. Company believes process can boost multi ...

Schmid develops new multi wafer texturing process The German production manufacturer has announced the development of a new process for the texturing of diamond wire cut multi silicon wafers. Schmid ...

It's already been a busy week for semiconductor manufacturing equipment giant Applied Materials. Yesterday, the company said it would acquire silicon wafer saw supplier HCT, then late yesterday also ...

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Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...