It's a mistake to assume wafer clamp rings have to polyimide. Several other work about as well. Silicon wafers aren't the only things that lose material in the various etching steps of IC ...

(Nanowerk News) Imec and KLA Tencor have established a metrology method for optimizing the etch rate uniformity (ERU) in a transformer coupled plasma (TCP) reactor. The proposed metrology method makes ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor ...

The PE-100 Convertible plasma system incorporates reactive ion etching and isotropic etching/cleaning technologies into a stand-alone benchtop system. The all aluminum chamber has over 240 in. 2 of ...

Whether Samsung still uses this particular apparatus is unknown, but vacuum chambers are necessary during the dry etching process due to the plasma. Types of etching Samsung describes wet etching as ...

Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...

The manufacture of semiconductors has attracted a lot of interest of late, especially because the U.S. produces such a small global share of the most advanced chips. Dutch company ASML’s standout ...