EDN

Through-wafer via leads STS to extend etch process

LONDON — Surface Technology Systems plc, a developer of plasma etch systems, has announced that it intends to build a Deep Reactive Ion Etch (DRIE) system suitable for 300-mm diameter wafers. The ...
Tech Xplore on MSN

New semiconductor etching process achieves five-fold speed improvement

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...
Semiconductor Engineering

Correlation Study of Actual Temperature Profile and In-line Metrology Measurements for Within-Wafer Uniformity Improvement and Wafer Edge Yield Enhancement

With advances in new technology it is getting more important to monitor all aspects of the influencing parameters in critical etch steps and utilize them as tuning knobs for within-wafer uniformity ...
DIGITIMES

Trymax ?? Plasma-based etching, stripping and curing process equipment maker

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor ...
AZOM

High-Density Plasma to Achieve Fast Etching and Deposition Rates—PlasmaPro 100 Cobra

Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure The PlasmaPro 100 Cobra ICP RIE system ...
AZOM

Maximize Performance and Optimizes Costs with Plasma Treatment

Nordson MARCH Addresses the Ways Plasma Treatment during Fan-out Wafer and Fan-out Panel-Level Semiconductor Packaging Maximizes Performance and Optimizes Costs In recent years, there has been an ...
Nasdaq

Lam Research Breaks New Ground in Etch Technology and Productivity for Chipmaking Processes

FREMONT, Calif., March 03, 2020 (GLOBE NEWSWIRE) -- Lam Research Corp. (Nasdaq: LRCX) today announced the launch of a completely transformed plasma etch technology and system solution, designed to ...
Semiconductor Engineering

Controlling Uniformity At The Edge

Chipmakers want every part of the wafer to produce, or yield, good die. Advances in process technologies over the years have just about made this a reality, even as feature dimensions continue to ...
AppleInsider

iPad Pro with OLED may be more expensive because of dry etching

Whether Samsung still uses this particular apparatus is unknown, but vacuum chambers are necessary during the dry etching process due to the plasma. Types of etching Samsung describes wet etching as ...
Digi Times

Trymax - Plasma-based etching, stripping and curing process equipment maker

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation ...