Santa Clara, CA and Kyoto, Japan, Nov. 12, 2024 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced new surface mount SiC Schottky barrier diodes (SBDs) that improve insulation resistance by ...
Power Integrations has introduced a wide-creepage package option for its InnoSwitch 3-AQ flyback switcher IC for automotive applications. A wide drain-to-source-pin creepage distance of 5.1 mm ...
Infineon Technologies has introduced the TO-220 FullPAK Wide Creepage package. The new package is offered for the 600 V CoolMOS CE, targeting a broad range of low power consumer applications. This ...
Infineon Technologies has added a number of wide body package options to its EiceDRIVER Compact family of galvanically isolated gate driver ICs. The 1EDI Compact 300 mil devices are supplied in a ...
1700 V InnoSwitch™3-AQ flyback switcher meets IEC60664-1 isolation standard SAN JOSE, Calif.--(BUSINESS WIRE)--Power Integrations (NASDAQ: POWI), the leader in high-voltage integrated circuits for ...
TOKYO--(BUSINESS WIRE)--Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company today announced the launch of a photocoupler that combine 15Mbps high-speed communication with low ...
New surface-mount automotive-grade silicon-carbide (SiC) Schottky barrier diodes (SBDs) from ROHM Semiconductor are intended to improve insulation resistance by increasing the creepage distance ...
A wide-creepage package option for Power Integrations’ InnoSwitch 3-AQ flyback switcher IC enhances safety and reliability in automotive applications. According to the company, the increased ...
Murata Manufacturing Co., Ltd. has developed a new line of multi-layer ceramic capacitors (MLCCs) that are well suited for electric vehicle (EV) applications. The new EVA series addresses the greater ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback