The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...
The kind of lapping plate Insaco uses plays a vital role in the lapping process. It significantly affects the output of this abrasive machining technique. A plate should not be too hard as it damages ...
Sponsored by Vitrek, LLCReviewed by Maria OsipovaSep 18 2025 Wafer lapping is a vital semiconductor thinning operation that requires precise control to avoid over-removal of material, which can result ...
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