It also includes a 18x12” self-healing cutting mat. This kit can be used for a large range of materials and wafers such as Si, GaAs The standard configuration includes one each: Diamond Scribe-Pen ...
In addition to everything in the Wafer Cleaving Kit (CSK-200M-LG), The Cleaving Station includes a 12” x 18” self-healing cutting mat, two diamond scribes for marking and scribing, one pen style ...
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