Learn how IP encapsulation/packaging and interoperability using IP-XACT enabled automation in a complex verification & validation flow for aeronautical systems.
Power integrity has become one the most critical issues as chip designs have transitioned to 130nm and 90nm processing technologies. Decreasing supply voltages, increasing device density and leakage ...
Designers today continue to be challenged with the need to manage power, timing and signal integrity concurrently throughout the design flow. Traditional power optimization techniques and today's ...
How advanced IC designs are replacing board-level systems. How an eFPGA can empower a system’s design. Designers continue to face greater challenges in the development of advanced embedded systems.
PowerBaum is now offered through ASICLAND's solution SoC model, in which ASICLAND is involved in customers' product development process early on. Power analysis from the early design stage is very ...
Pain points of the existing floorplan designing process. How artificial intelligence can optimize this process to reduce the time taken from weeks to just hours. Potential applications of expanding ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced that the Rambus Root of Trust RT-640 Embedded ...
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