Given complexity, yield, power and other challenges with leading edge manufacturing, semiconductor foundries increasingly have been forced to require more and more restrictive design rules with each ...

Indium compounds are showing great promise for 3D in-memory compute and RF integration, but more work is needed. Researchers continue to make headway into 3D device integration particularly with ...

Imec has developed an electrically functional solution for the 5nm back-end-of-line (BEOL). The solution is a full dual-damascene module in combination with multi-patterning and multi-blocking.

San Francisco, CA. Imec’s annual Technology Forum kicked off today in connection with SEMICON West with two announcements focused on how 2D materials can be used to scale FETs for very advanced ...