Performing modal simulation using a FEM mesh. The design and analysis of an IP67-rated rectangular enclosure. Adding epoxy resin to a vibration sensor enclosure. Mounting techniques for a vibration ...
During the ANSYS Conference & 28 th CADFEM User’s Meeting held 2010 in Aachen, Germany, a new approach was presented, which facilitates the integration of experimental modal analysis test into the CAE ...
When designing printed circuit boards (PCBs), keep in mind the major causes of electronic failure: thermal cycling, vibration, and mechanical shock and drop. You can perform a variety of physical ...
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